Jason

Wafer 2D+3D Inspection/Metrology System

Hi-speed3D Full Bump measurement、Bump Diameter、Bump Height 3D multiple metrology system、support deepth/width ratio products (AR 1:7) μBump tall pillar 3D measurement Various engineering analysis visual topography maps (contour maps, contour maps, 3D topography maps) Automatic switching of multi-magnification microscopic detection system Nanoscale Auto Focus System Large-size wafer alignment system (Multi-View) Recipe offline setting function Multi-Thread image …

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Wafer Defects Inspection System

Automatic switching of multi-magnification microscopic detection system Nanoscale Auto Focus System Large-size wafer alignment system (Multi-View) Recipe offline setting function Multi-Thread image comparison algorithm system Visual measurement system by using image measurement method to detect key dimension Support CAD file import Automatic calibration and inspection system Customized report output Fast loading and unloading (<10sec) Defect …

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Wafer Coating Defect Inspection System

High-resolution telecentric inspection system Digital auto-focus system Large-size wafer alignment system (Multi-View) Visual measurement system by using image measurement method to detect key dimension Automatic calibration and inspection system Customized report output Fully automatic fast loading and unloading Defect detection categories: edge chipping, plated same surface, film crack, particle, damage, scratch

Optical Lens/Lens module Defect Inspection System

Lens       Inspecting Defect Size  : 12um Inspection Defect Type : Particle, black spots, white spots, bubbles, scratches, stains, poor coating Cycle Time : 0.4 sec/ea.(± 0.1) Pixel size : 5.5um (Pixel resolution 6.11um) Magnifications : 0.9 X FOV   : 12*12 (mm) Tray : 20 coating trays/magazine Lens Module      Inspecting Defect Size …

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Camera Module Active Alignment System

  • 以SFR/MTF計算結果進行六軸主動式精密對位 6DoF Active Alignment with SFR /MTF Pattern
  • 複合式光學系統,可選用Collimators ( 5 or 9 pcs / FOV up to 200°)或是Light panel with Relay lens (FOV up to 130°)
  • 全自動點膠跟影像確認系統Auto Glue Dispensing & Check
  • UV光源進行UV膠固化UV Light Source Pre-curing
  • 可依客戶產品特性選擇以Lens或是Sensor作爲AA基準面
  • 無塵等級Class 100
  • 離子槍清潔功能,清潔Lens底面以及Holder上表面(需搭配自動上下料機)Plasma (Lens bottom surface/Holder top surface)
  • 可選配影像檢查功能Final Test (MTF/SFR) / Blemish、Particle & Hot pixel (Option)
  • 設備可選擇手動上下料或是搭配全自動上下料系統
  • UPH:150 / 90 (如要執行Pre AA)