Jason

OCR/RCM

Develop automation scripts based on factory equipment and process requirements to improve on-site operation efficiency. Use RCM/OCR scripts to arrange highly repetitive actions to improve work accuracy, avoid personnel operation and judgment errors, reduce work errors and risks, and improve yield rates. SECS/GEM function: According to each process and equipment flow for software development and […]

OCR/RCM Read More »

2D VR Lens Defect Inspection

  • 曲面鏡片瑕疵檢查機是可泛用於各種曲面鏡片的瑕疵檢查的視覺檢測設備。
  • 檢測設備由共軛雷射線掃描視覺系統、X/Y/Z/θx/θy 5軸機構、鏡片固定治具與視覺辨識軟件和運控軟件所構成;可依照DUT的形狀尺寸,更換固定治具、編寫運控軟體,調整視覺檢測條件搭配出需求的檢出條件,檢測鏡片瑕疵。
  • 可檢測玻璃、塑膠材質的鏡片,可檢測非球面曲面、圓弧曲面與平面的鏡片,可檢測無鍍膜和已鍍膜的鏡片(註),可檢測鏡片涵蓋眼鏡鏡片、相機鏡片、AR/VR鏡片、手機平面/弧面玻璃、Cover Glass等各種玻璃與鏡片。

2D VR Lens Defect Inspection Read More »

2D Semiconductor Wafer/Chip Defect Inspection

  • 變倍光學系統
    高亮度光源自適應系統使用物鏡移載平台,實現相機系統可進行多倍率光學系統
    執行不同倍率切換的同時,光源及Recipe切換適應與校正
  • 分散式運算系統
    整合多台PC分散式架構,將分析引擎與管理系統安裝於不同主機,再行整合以提高AOI與AI算力
  • AI + AOI系統
    AI + AOI系統建模的瑕疵檢測,更能有效提升辨識精準度、生產力、效率及合理性
  • Flying Trigger
    在運動過程中進行拍攝,减少設備停頓動作,提升提高工作效率
  • Chip & Wafer共用平載台技術
    使用高精密高剛性移載系統,在適應多種物料多尺寸的同時,達到高重現、高精密及高速移動需求
  • Change Kit自我比對
    工單更換後,進行自我檢查,以防止人為不當操作造成機台損壞
  • 不同尺寸物料混匣技術
    彈性化設計可適用尺寸不同物料,同時進行檢測

2D Semiconductor Wafer/Chip Defect Inspection Read More »

2D Lens/Lens Module Defect Inspection

Lens Items Specification Remark Min. detection size 12um Short side length base Inspecting items Particle, black spots, white spots, bubbles, scratches, stains, poor coating Inspecting area: lens top and button surface Underskill ≤ 0.5% (± 0.3%) Validation quantity: 1000 benchmarks for mass production products Except for missed detection and over-detection due to ±1 pixel size

2D Lens/Lens Module Defect Inspection Read More »