- Hi-speed3D Full Bump measurement、Bump Diameter、Bump Height
- 3D multiple metrology system、support deepth/width ratio products (AR 1:7) μBump tall pillar 3D measurement
- Various engineering analysis visual topography maps (contour maps, contour maps, 3D topography maps)
- Automatic switching of multi-magnification microscopic detection system
- Nanoscale Auto Focus System
- Large-size wafer alignment system (Multi-View)
- Recipe offline setting function
- Multi-Thread image comparison algorithm system
- Visual measurement system by using image measurement method to detect key dimension
- Support CAD file import
- Automatic calibration and inspection system
- Customized report output
- Fast loading and unloading (<10sec)
- Detectable defects (Residue, Particle, Damage, Open/Short, Scratch)
Options：
- OCR Function
- ReView System
- EDC Function
- Real Time Process Status Display
- SECS/GEM Compatible
- SEMI S2 Certification
- High Warpage Solution
