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Wafer Coating Defect Inspection System

  • High-resolution telecentric inspection system
  • Digital auto-focus system
  • Large-size wafer alignment system (Multi-View)
  • Visual measurement system by using image measurement method to detect key dimension
  • Automatic calibration and inspection system
  • Customized report output
  • Fully automatic fast loading and unloading
  • Defect detection categories: edge chipping, plated same surface, film crack, particle, damage, scratch