- High-resolution telecentric inspection system
- Digital auto-focus system
- Large-size wafer alignment system (Multi-View)
- Visual measurement system by using image measurement method to detect key dimension
- Automatic calibration and inspection system
- Customized report output
- Fully automatic fast loading and unloading
- Defect detection categories: edge chipping, plated same surface, film crack, particle, damage, scratch
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- Optical and Vision Inspection System
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- Wafer Coating Defect Inspection System
